Know About The Materials for High Temperature PCBs

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Published date: April 2, 2025
  • Location: Shenzhen, New York City, New York, United States
In situations where high-power operation runs continuously alongside non-cycling temperature variations, PCB laminate materials should primarily serve as heat spreaders. In order to lower the temperature of high-power components, the laminate substrate must channel heat away from them. For power dissipation, the substrate must have a higher thermal conductivity, which can be achieved with ceramic or metal cores.

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