Check with seller Know About the SiP Package Substrates in Details Shenzhen
- Location: Shenzhen, Shenzhen, Guangdong, China
SiP stands for System-in-Package. It's an advanced packaging technology that integrates multiple semiconductor chips or components into a single package. This integration can include different types of chips such as microprocessors, memory modules, sensors, and more, allowing for compact and efficient electronic systems.
The substrate is a key component of SiP packaging. It serves as the physical and electrical foundation for mounting and connecting the individual chips or components within the package. Substrates provide the electrical interconnections between the various components and the external connections for input/output (I/O) signals.
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